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Be careful, the Intel Arrow Lake still have temperature problems

During this year we are seeing a large number of new developments, and one of the most anticipated by hardware enthusiasts are the new Intel processors, which as we have seen through the latest rumors and leaks could be presented and launched during this month of October. But not all the news that we know through rumors is good, and a well-known overclocker has indicated that the new design of the processors Arrow Lake could present problems temperature by having a really important change in the hotspot.

All the processors that we can find have a point where the heat is concentrated to ensure that the IHS fulfills its function of transmitting the high temperatures that a chip can reach directly to the cooling system that we have. In general, this point is usually found in the area where the cores are located inside the chip, since they are the ones that generate the greatest amount of heat as they are the main part that we can find in a processor, but depending on how the cores are placed, the manufacturer, may vary by location.

A change that will come to the new Intel processors could present temperature problems with certain cooling systems

The new Arrow Lake are probably the most anticipated processors of the latest generations of Intel, and the company has created a great marketing campaign around them, mainly with all the aspects oriented towards artificial intelligence that have become so important lately. In addition to this, rumors and leaks have indicated that the top processors of this generation would manage to surpass (at least in the benchmarks) the power of all the previous ones that we have seen, and even those of the direct competition they have.

But in terms of performance, that is not exactly where we find the problem with these processors, but with the changes that often make them inferior to those of their main competitor, and this time the location of the hotspot of these new processors could be a setback. for certain configurations. As indicated by the famous overclocker der8auer, This point could be shifted to the north compared to chips prepared for the LGA1700 socket, something that would cause problems when installing a liquid cooling system:

«The hot spot of 1851 is significantly further north than that of 1700. This means that, for ideal cooling, it is necessary to move the cooling center to combat the hot spot. It also means that turning the block 180º would impair performance. For us, the easiest thing would be to have the entrance orientation to the north and the exit orientation to the south.”

Intel Socket LGA1851

The difference between LGA1851 compatible processors and those that fit the LGA 1700 is basically that the latter had the hot spot somewhere around the center, which helped cool the CPUs regardless of whether users installed the heatsink. the same in an opposite orientation (as indicated by der8auer), so the change in the location of the hot spot, a 180° rotation can harm the thermal performance of the water coolers, since the location of the hot spots will be exchanged. entry and exit ports.

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