The new generations of components bring a large number of changes that allow them to increase the performance they are capable of offering, causing us to often see a series of new designs because the previous ones are not capable of incorporating everything necessary for this. This obviously also happens in graphics cards, which change their appearance to allow the main manufacturers to modify the chips they include with higher power versions, something that various rumors and leaks indicate will also happen with the RTX 5090who will opt for a PCB and a feeding design very different from the previous ones.
One of the most anticipated revelations of the CES that will take place in a couple of weeks is the presentation of the new generation of NVIDIA graphics cards, both for gaming and AI, since the brand has great news prepared for both. But if we focus on what may attract our attention the most as consumers, obviously we must mention only those designed for gaming, the RTX 5000 that will bring great news and that will have a flagship version with the maximum possible power that can be found in a component of this type, the RTX 5090.
RTX 5090 changes will include a new power and PCB design
There are more and more details that we know about the different products that will be presented at CES, since companies are preparing all the necessary information to reveal it during the event, something that obviously implies that some other information can be lost and reach the hands of the leakers. Virtually all the details we know about the RTX 5090 are based on these leaks and rumors, making us know a lot about what this graph will be like long before its official presentation.
Now one of the latest data that we can find details what the power supply and the design of the board will be like compared to its predecessors, establishing a series of changes to offer much greater power. Starting with the power supply design, we find that it would have a 16+6+7 power phase design compared to the configuration that the RTX 4090 had, which used a 20+3 phase, while it could have a 600W TGP, although obviously the actual TDP of the GB202 chip should be less than this.
On the other hand, the printed circuit board (PCB) that it will use would include 14 layers due to the complexity of both the GDDR7 memory modules and the power supply that we have mentioned, something that is quite far from traditional designs since even High-end GPUs built for overclocking feature 12-layer designs. And finally, it should be mentioned that they will be compatible with the PCI Express 5.0 x16 interface, while what was an open secret is practically confirmed, the fact that it will implement the 12V-2×6 connector, which is already practically beginning to be present. in all new generation mid-high-end graphics cards.
