Most of the time, when a company does not implement a technology that could make its products achieve superior performance, it is usually related to the technical limitations they have when manufacturing them. But in the case of AMD they could have the capabilities to add a memory system Dual 3D V-Cache to your processors X3Da configuration that would incorporate one of these memories in the two CCDs, but the reason why they do not really plan to do so has to do with the performance-price ratio that it would offer, since the improvement would not be large enough, while the price would be through the roof.
One of the key aspects that has been presented amd during the CES are your new X3D processorsAfter seeing the great reception that the 9800X3D had, the company was clear that it was necessary to present the new versions in a big way, also offering the date on which the new models will arrive. Both the 9900X3D like him 9950X3D will arrive in Marchand although we do not know the price it will have, the company has made sure to prevent the extra cost from being too large, eliminating the possibility of incorporating technologies that would greatly increase the price of the processor such as the dual 3D V-Cache.
AMD’s capabilities allow it, but it would be a “waste of money”
There are many times that we can see how a brand is clear that it can do something, and in the case of amd apparently they are pretty sure that it is possible for them to implement a system that offers two memories 3D V-Cache within the same processor, incorporating one to each CCD that it has. This was one of the main rumors about the brand’s new X3D processors, many users indicated that it was possible that the company would end up developing models with this configuration that would allow more than 128 MB of L3 cache.
But in this regard, it is the company itself that has indicated that this would be an unnecessary waste of money, that is, it is technologically viable, but not economically. In this regard, AMD has also stated that a configuration created in this way would not benefit those who buy its processors enough to justify the large price increase that would be required to produce a CPU of this type.
In this case, what they have chosen to do is try to improve the thermal capacity of the processor. They have improved the design by changing the area where both the CCD and the 3D V-Cache are located, something that allows for better stabilization of the temperatures that can occur. reach. This obviously implies that they are designed to allow the brand to increase the clock speeds, while also offering users a number of superior overclocking capabilities.
We can also see this in the consumption that the Ryzen 9 9000X3D models will have, since as we well know, these models will have a TDP of 170 W, 50 W more than the top-of-the-range X3D models of the previous generation.
